Smartphone companies often introduce their own chips to achieve greater control over their devices’ processing and computational models. Oppo already has its own NPU MariSilicon X and a connectivity chip called MariSilicon Y, but still lacks a true SoC – system-on-a-chip.
According to a Mediatek executive, speaking at a foreign investment forum in Hsinchu, Taiwan, Oppo wants to have a true chipset in order to retain its competitive edge. An insider revealed the Guangdong maker already taped out their chip, and it will hit the market in 2024.
Taping out is a term in electronics design, meaning the design process for integrated circuits is already completed, and the product is ready to be sent into manufacturing.
The conference taking place in Hsinchu is not a coincidence – the city in northwestern Taiwan is where TSMC set up its headquarters and we may or may not see the manufacturer partner with Oppo.
Previous reports already revealed Oppo invested more than CNY 10 billion (about $1.4 billion) setting up IC design centers across China, including Beijing, Shenzhen, and Shanghai.
