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This White Paper provides a comprehensive overview of how single-phase direct liquid cooling manages the rising thermal demands of AI and high-performance computing, and how it compares with two-phase and immersion approaches.
What you will learn about:
As computing systems move toward denser processors, tightly coupled server nodes, and higher-power racks, managing the heat they generate has become a defining challenge in data center design. Modern AI accelerators can dissipate well over 1,000 watts, and a single rack may release more than 100 kilowatts of heat. This is far beyond what air cooling can practically remove. Single-phase direct liquid cooling addresses this by circulating water or a water-glycol coolant through coldplates mounted directly on high-heat components. The coolant absorbs the heat and carries it away in a closed loop to a coolant distribution unit. Because liquid stores far more heat than air and removes it much faster, this approach supports higher chip and rack densities within a smaller footprint. This paper explains how single-phase direct liquid cooling works, how it compares with two-phase and immersion cooling, and how rising processor power and rack density are shaping the future of thermal
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IEEE Spectrum Magazine, the flagship publication of the IEEE, explores the development, applications and implications of new technologies. It anticipates trends in engineering, science, and technology, and provides a forum for understanding, discussion and leadership in these areas.
1. Same tier 3 topics + same partner [3],
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Source: IEEE Spectrum
